Superabrasives and Abrasives Availability and Application Chart

Product Description Shape and Size Info Typical Applications
Monocrystalline Structure Diamonds
Resin Bond System		 These low cost diamonds are the most friable, and therefore will produce minimum scratches. Irregular shape crystals. Available in variety of sizes from 0.1 through 120 um This type of powder is recommended for general application when surface finish and processing cost are the most important such as steels, non-ferrous materials, carbides, and soft ceramics. Electronic grade diamonds are available with contamination level as low as 5 PPM.
Monocrystalline Structure Diamonds
Metal Bond System		 More expensive than resin bond powder. Blocky shape crystals. Available in variety of sizes from 0.1 through 120 um Recommended for specific applications when the material removal rate is most important and/or when resin bond powder is not performing up to standard, such as hard ceramics, glass, and stones. Electronic grade diamonds are available with contamination level as low as 5 PPM.
Polycrystalline Structure Diamond Powders Super high friable diamond has multi edge system with hundreds crystals Particle shape varies from round to irregular depending on size. Available in the following ranges: 0-0.1; 0.05-0.15, 0.05-0.2, 0.5-1.0; 0-1.0; 0.5-1.5; 1-2; 0-2; 1-3; 2-4, 4-8, 0-6 um. Recommended for applications where material removal rate and/or surface finish are more important than processing cost, and is impossible to achieve in any other way. Computer disks, optical parts, etc.

Our DP3-SC Scratch Controlled powder is extremely suitable for electronic applications such as disc texturing and GMR Head lapping and polishing operations
Boron Carbide Powder
(Dry Classified)		 Low friability Premium powder to be used instead of super friable diamonds. Irregular to blocky shape. Available in sizes FEPA f40 through F1500 Slicing of Silicon Carbide and Sapphire wafers, lapping and polishing of the hard ceramics where higher abrasive concentration can provide better flatness. Can provide up to 25% higher performance in slicing and lapping operations in comparison to wet classified powders.
Silicon Carbide Powder This low cost material is the most friable of the carbon content abrasives. Particles are 99% blocky shape. Available in FEPA sizes from F220 through F1500. General Application where cost of raw materials is critical. Used for slicing, lapping and polishing of glass and germanium wafers and lapping of piston rings and gears.


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